Corporate Milestones

    1992 Incorporation of Super Components (Singapore)

    1993 IC Leadframe Taping & Down-setting Systems

    1995 Line Scan Vision Inspection Systems

    1999 TBGA Manufacturing Systems

    2000 LOC Taping Systems

    2001 Flexible Printed Circuit Manufacturing Systems

    2002 Incorporation of Super Components (Dongguan)

    2003 Lithium Polymer Battery Manufacturing Systems

    2004 Roll to Roll Lamination Systems

    2005 QFN Tape (Nitto) Lamination Systems

    2006 QFN Tape (Hitachi) Lamination Systems

    2009 RFID Inlay Assembly Line

    2010 LED Leadframe Manufacturing Systems

    2010 PV Solar Cells Stringing Systems

    2011 Standard 10 Ton Servo Press

    2012 8X+8Y Segment High Speed Taping System

    2013 Ultra-wide Touch Panel Film Lamination System

    2015 Post-Bond QFN Tape Attachment System

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