Corporate Milestones

• 1992 Incorporation of Super Components (Singapore) • 1993 IC Leadframe Taping & Down-setting Systems
• 1995 Line Scan Vision Inspection Systems
• 1999 TBGA Manufacturing Systems
• 2000 LOC Taping Systems
• 2001 Flexible Printed Circuit Manufacturing Systems
• 2002 Incorporation of Super Components (Dongguan)
• 2003 Lithium Polymer Battery Manufacturing Systems
• 2004 Roll to Roll Lamination Systems
• 2005 QFN Tape (Nitto) Lamination Systems
• 2006 QFN Tape (Hitachi) Lamination Systems
• 2009 RFID Inlay Assembly Line
• 2010 LED Leadframe Manufacturing Systems
• 2010 PV Solar Cells Stringing Systems
• 2011 Standard 10 Ton Servo Press
• 2012 8X+8Y Segment High Speed Taping System
• 2013 Ultra-wide Touch Panel Film Lamination System
• 2015 Post-Bond QFN Tape Attachment System

Contact US

Super Components (Singapore) Pte Ltd
Blk 3017A Ubi Road 1 #01-20 Kampong Ubi Industrial Estate Singapore 408709
Tel: (65) 6741 1677
Fax: (65) 6743 6313
Email: sales@supercom.com.sg
Website: www.supercom.com.sg

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